View BD3532EFV_4578285.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

TECHNICAL NOTE
High-performance Regulator IC Series for PCs
Termination Regulators for DDR-SDRAMs
BD3533F/FVM/EKN(1A),BD3531F(1.5A),BD3532F/EFV/KN(3A)
Description BD3533/31/32 is a termination regulator compatible with JEDEC DDR-SDRAM, which functions as a linear power supply incorporating an N-channel MOSFET and provides a sink/source current capability up to 1A, 1.5A, and 3A respectively. A built-in high-speed OP-AMP specially designed offers an excellent transient response. Requires 3.3 volts or 5.0 volts as a bias power supply to drive the N-channel MOSFET. Has an independent reference voltage input pin (VDDQ) and an independent feedback pin (VTTS) to maintain the accuracy in voltage required by JEDEC, and offers an excellent output voltage accuracy and load regulation. Also has a reference power supply output pin (VREF) for DDR-SDRAM or a memory controller. When EN pin turns to "Low", VTT output becomes "Hi-Z" while VREF output is kept unchanged, compatible with "Self Refresh" state of DDR-SDRAM.
Features 1) Incorporates a push-pull power supply for termination (VTT) 2) Incorporates a reference voltage circuit (VREF) 3) Incorporates an enabler 4) Incorporates an undervoltage lockout (UVLO) 5). Employs SOP8 package 6) Employs MSOP8 package 7) Employs HQFN20V package 8) Employs HTSSOP-B20 package 9) Employs VQFN28V package 10) Incorporates a thermal shutdown protector (TSD) 11) Operates with input voltage from 2.7 to 5.5 volts 12) Compatible with Dual Channel (DDR-II)
Use
Power supply for DDR I/II - SDRAM
Line up Parameter Output Current Vcc Range Soft Start Function Temperature Package
BD3533F/FVM/EKN 1.0A 2.7V5.5V -20100 SOP8/MSOP8/HQFN20V
BD3531F 1.5A 4.5V5.5V x -10100 SOP8
BD3532F/EFV/KN 3 4.35.5V -40100 SOP8/HTSSOP-B20/VQFN28
Oct. 2008
ABSOLUTE MAXIMUM RATINGS
BD3533F/FVM/EKN Parameter Input Voltage Enable Input Voltage Termination Input Voltage VDDQ Reference Voltage Output Current Power Dissipation1 Power Dissipation2 Power Dissipation3 Power Dissipation4 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VEN VTT_IN VDDQ ITT Pd1 Pd2 Pd3 Pd4 Topr Tstg Tjmax BD3533F 7 7
*1*2
BD3533FVM 7 7
*1*2
BD3533EKN 7 7
*1*2
Unit V V V V A mW mW mW mW
7 *1*2
*1*2
7 *1*2
*1*2
7 *1*2
*1*2
7 *1*2 3 560 *3 690 *4 -20+100 -55+150 +150
7 *1*2 1 437.5 *5 -20+100 -55+150 +150
7 *1*2 3 500 *6 750 *7 1750 *8 2000
*9
-20+100 -55+150 +150
*1 Should not exceed Pd. *2 Instantaneous surge voltage, back electromotive force and voltage under less than 10% duty cycle. *3 Reduced by 4.48mW for each increase in Ta of 1 over 25(With no heat sink). *4 Reduced by 5.52mW for each increase in Ta of 1 over 25(When mounted on a board 70mmx70mmx1.6mm Glass-epoxyPCB). *5 Reduced by 3.5mW for each increase in Ta of 1 over 25(With no heat sink). *6 Ta25(no heat sink)4mW/ increase. *7 Ta25(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which does not have copper on the back side). *8 Ta25(when mounted on 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 1 layer ( 60mm x 60mm ) of copper on the back side)14mW/ increase. *9 Ta25(When mounted on board 70mm x 70mm x 1.6mm Glass-epoxy PCB which has 2 layers ( 60mm x 60mm ) of copper on the back side )16mW/ increase.
BD3531F Parameter Input Voltage EN Input Voltage Termination Input Voltage VDDQ Reference Voltage Output Current Power Dissipation1 Power Dissipation2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VEN VTT_IN VDDQ ITT Pd1 Pd2 Topr Tstg Tjmax Limit 7*
1
Unit V V V V A
2
7 *1 7* 3 560 * -10 -55 +150 690 *3
1
7 *1
mW mW
*1 Should not exceed Pd. *2 Reduced by 4.48mW for each increase in Ta of 1 over 25(With no heat sink). *3 Reduced by 5.52mW for each increase in Ta of 1 over 25(When mounted on a board 70mmx70mmx1.6mm Glass-epoxyPCB).
BD3532F/EFV/KN Parameter Input Voltage Enable Input Voltage Termination Input Voltage VDDQ Reference Voltage Output Current Power Dissipation1 Power Dissipation2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC VEN VTT_IN VDDQ ITT Pd1 Pd2 Topr Tstg Tjmax BD3532F 7 *1 7*
1 1
BD3532EFV 7 *1 7* 7* 3 1000 *
4 1 1
BD3532KN 7 *1 7* 7* 3 460 *5 725 *6 -40+100 -55+150 +150
1 1
Unit V V V V A mW mW
7* 3
7 *1 560 *2 690 *3 -40+100 -55+150 +150
7 *1
7 *1
-40+100 -55+150 +150
*1 Should not exceed Pd. *2 Reduced by 4.48mW for each increase in Ta of 1 over 25(With no heat sink). *3 Reduced by 5.52mW for each increase in Ta of 1 over 25(When mounted on a board 70mmx70mmx1.6mm Glass-epoxyPCB). *4 Reduced by 8.0mW for each increase in Ta of 1 over 25(When mounted on a board 70mmx70mmx1.6mm Glass-epoxyPCB). *5 Reduced by 3.68mW for each increase in Ta of 1 over 25(With no heat sink). *6 Reduced by 5.80mW for each increase in Ta of 1 over 25(When mounted on a board 70mmx70mmx1.6mm Glass-epoxyPCB).
2/16
RECOMMENDED OPERATING CONDITIONS BD3533F/FVM/EKN(Ta=25) Parameter Input Voltage Termination Input Voltage VDDQ Reference Voltage Enable Input Voltage BD3531F(Ta=25) Parameter Input Voltage Termination Input Voltage EN Input Voltage BD3532F/EFV/KN(Ta=25) Parameter Input Voltage Termination Input Voltage EN Input Voltage Symbol VCC VTT_IN VEN MIN 4.3 1.0 -0.3 MAX 5.5 5.5 5.5 Unit V V V Symbol VCC VTT_IN VEN MIN 4.5 1.0 -0.3 MAX 5.5 5.5 5.5 Unit V V V Symbol VCC VTT_IN VDDQ VEN MIN 2.7 1.0 1.0 -0.3 MAX 5.5 5.5 2.75 5.5 Unit V V V V
No radiation-resistant design is adopted for the present product.
ELECTRICAL CHARACTERISTICS BD3533F/FVM/EKN ELECTRICAL CHARACTERISTICS(unless otherwise noted, Ta=25 VCC=3.3V VEN=3V VDDQ=1.8V VTT_IN=1.8V) Parameter Standby Current Bias Current [Enable] High Level Enable Input Voltage Low Level Enable Input Voltage Enable Pin Input Current [Termination] Termination Output Voltage 1 VTT1 VREF -30m VREF -30m 1.0 VREF VREF +30m VREF +30m -1.0 50 40 0.9 0.9 0.8 0.8 V ITT=-1.0A to 1.0A *7 Ta=0 to 100 VCC=5V, VDDQ=2.5V VTT_IN=2.5V ITT=-1.0A to 1.0A *7 Ta=0 to 100 VENHIGH VENLOW IEN 2.3 -0.3 7 5.5 0.8 10 V V uA VEN=3V Symbol IST ICC Standard Value MIN TYP 0.8 2 MAX 1.6 4 Unit mA mA Condition VEN=0V VEN=3V
Termination Output Voltage 2
VTT2
VREF
V
Source Current Sink Current Load Regulation Line Regulation Upper Side ON Resistance 1 Lower Side ON Resistance 1 Upper Side ON Resistance 2 Lower Side ON Resistance 2
ITT+ ITTVTT Reg.l HRON1 LRON1 HRON2 LRON2
20 0.45 0.45 0.4 0.4
A A mV mV VCC=5V, VDDQ=2.5V VTT_IN=2.5V VCC=5V, VDDQ=2.5V VTT_IN=2.5V ITT=-1.0A to 1.0A
*7 Design Guarantee
3/16
ELECTRICAL CHARACTERISTICS BD3533F/FVM/EKN ELECTRICAL CHARACTERISTICS(unless otherwise noted, Ta=25 VCC=3.3V VEN=3V VDDQ=1.8V VTT_IN=1.8V) Parameter [Input of Reference Voltage] Input Impedance Output Voltage1 Output Voltage2 ZVDDQ VREF1 VREF2 70
1/2xVDDQ -18m 1/2xVDDQ -40m 1/2xVDDQ -25m
Symbol
Standard Value MIN TYP 100 1/2xVDDQ 1/2xVDDQ MAX 130
1/2xVDDQ +18m 1/2xVDDQ +40m 1/2xVDDQ +25m
Unit
Condition
k V V IREF=-5mA to 5mA *7 Ta=0 to 100 IREF=-10mA to 10mA *7 Ta=0 to 100
VCC=5V, VDDQ=VTT_IN=2.5V IREF=-5mA to 5mA Ta=0 to 100*7 VCC=5V, VDDQ=VTT_IN=2.5V
Output Voltage3
VREF3
1/2xVDDQ
V
Output Voltage4 [Reference voltage] Source Current Sink Current [UVLO] UVLO OFF Voltage Hysteresis Voltage
*7 Design Guarantee
VREF4
1/2xVDDQ -40m
1/2xVDDQ
1/2xVDDQ +40m
V
IREF=-10mA to 10mA Ta=0 to 100*7
IREF+ IREFVUVLO
VUVLO
20 2.40 100
2.55 160
-20 2.70 220
mA mA V mV VCC : sweep up VCC : sweep down
BD3531F ELECTRICAL CHARACTERISTICS(unless otherwise noted, Ta=25 VCC=5V VEN=3V VDDQ=2.5V VTT_IN=2.5V) Parameter Standby Current Bias Current [Enable] Hi Level Enable Input Voltage Low Level Enable Input Voltage Enable Pin Input Current [Termination] Termination Output Voltage Source Current Sink Current Load Regulation Line Regulation Upper Side ON Resistance Lower Side ON Resistance [Input of Reference Voltage] Input Impedance [Reference voltage] Output Voltage1 Output Voltage2 Source Current Sink Current [UVLO] UVLO OFF Voltage Hysteresis Voltage
*8 Design Guarantee
Symbol IST ICC VENHI VENLOW IEN
Standard Value MIN 2 -0.3 VREF -30mV 1.5 1/2xVDDQ-30m
TYP 0.8 2 7
MAX 1.6 4 5.5 0.8 10 VREF +30mV -1.5 40 40 0.8 0.8 1/2xVDDQ+30m
Unit mA mA V V uA
Condition VEN=0V
VEN=3V Io=-1.5A to 1.5A 8 Ta=0 to 100 *
VTT ITT+ ITTVTT Reg.l HRON LRON ZVDDQ VREF1 VREF2 IREF+ IREFVUVLO VUVLO
VREF 20 0.4 0.4 100
1/2xVDDQ
V A A mV mV k V V mA mA V mV
Io=-1.5A to 1.5A VCC=4.5V to 5.5V
IREF=0mA IREF=-10mA to 10mA Ta=0 to 100 *8
1/2xVDDQ -40m
1/2xVDDQ
1/2xVDDQ +40m
10 4.2 100 4/16
20 -20 4.35 160
-10 4.5 220
VCC : Sweep up VCC : Sweep down
BD3532F/EFV/KN ELECTRICAL CHARACTERISTICS(unless otherwise noted, Ta=25 VCC=5V VEN=3V VDDQ=2.5V VTT_IN=2.5V) Parameter Standby Current Bias Current [Enable] Hi Level Enable Input Voltage Low Level Enable Input Voltage Enable Pin Input Current [Termination] Termination Output Voltage Source Current Sink Current Load Regulation Line Regulation Upper Side ON Resistance Lower Side ON Resistance [Input of Reference Voltage] Input Impedance Output Voltage1 Output Voltage2 Output Voltage1' ZVDDQ VREF1 VREF2 VREF1' 70 100 130 k V V V IREF=0mA IREF=-10mA to 10mA Ta=0 to 100 *9 VDDQ=VTT_IN1=VTT_IN2=1.8V IREF=0mA VDDQ=VTT_IN1=VTT_IN2=1.8V IREF=-10mA to 10mA 9 Ta=0 to 100 * 1/2xVDDQ 1/2xVDDQ 1/2xVDDQ -30mV +30mV 1/2xVDDQ 1/2xVDDQ 1/2xVDDQ -40mV +40mV 1/2xVDDQ 1/2xVDDQ 1/2xVDDQ -30mV +30mV 1/2xVDDQ 1/2xVDDQ 1/2xVDDQ -40mV +40mV 20 20 4.0 100 4.15 160 -20 -20 4.3 220 VTT ITT+ ITTVTT Reg.l HRON LRON VREF -30mV 3 VREF 20 0.2 0.2 VREF +30mV -3 40 40 0.4 0.4 V A A mV mV Io=-3A to 3A VCC=4.3V to 5.5V Io=-3A to 3A Ta=0 to 100 *9 VENHI VENLOW IEN 2.3 -0.3 7 5.5 0.8 10 V V uA VCC=4.3V to 5.5V 9 Ta=0 to 100 * VCC=4.3V to 5.5V 9 Ta=0 to 100 * VEN=3V Symbol IST ICC Standard Value MIN TYP 0.8 2 MAX 1.6 4 Unit mA mA VEN=0V Condition
Output Voltage2' Source Current1 Sink Current1 Source Current2 Sink Current2 [UVLO] UVLO OFF Voltage Hysteresis Voltage
VREF2' IREF1+ IREF1IREF2+ IREF2VUVLO VUVLO
V mA mA mA mA V mV
VDDQ=VTT_IN1=VTT_IN2=1.8V VDDQ=VTT_IN1=VTT_IN2=1.8V VCC : sweep up VCC : sweep down
*9 Design Guarantee
5/16
Reference Data
VTT(10mV/Div)
VTT(10mV/Div)
VTT(20mV/Div)
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
Fig.1 DDR(-1A1A) BD3531
Fig.2 DDR(-1A1A) BD3532
Fig.3 DDR(-1A1A) BD3533
VTT(20mV/Div) VTT(10mV/Div) VTT(10mV/Div)
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
Fig.4 DDR(1A-1A) BD3531
Fig.5 DDR(1A-1A) BD3532
Fig.6 DDR(1A-1A) BD3533
VTT(10mV/Div)
VTT(10mV/Div)
VTT(20mV/Div)
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
Fig.7 DDR(-1A1A) BD3531
Fig.8 DDR(-1A1A) BD3532
Fig.9 DDR(-1A1A) BD3533
VTT(10mV/Div)
VTT(10mV/Div)
VTT(20mV/Div)
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
ITT(1A/Div) 10sec/Div
Fig.10 DDR(1A-1A) BD3531
Fig.11 DDR(1A-1A) BD3532
Fig.12 DDR(1A-1A) BD3533
6/16
1.252
0.902 0.901 0.9
1.258 1.256 1.254
1.251
VREF(V)
VREF(V)
1.25
VTT(V)
-5 0 IREF(mA) 5 10
1.252 1.250 1.248
0.899 0.898 0.897 -10
1.249
1.246 1.244 -2 -1 0 ITT(A) 1 2
1.248 -10
-5
0 IREF(mA)
5
10
Fig.13 IREF-VREF (DDR-)
Fig.14 IREF-VREF (DDR-)
Fig.15 ITT-VTT (DDR-)
0.91 0.912 0.91 0.910 0.90 0.908
VTT(V) VTT(V)
VCC EN VDDQ VTT IN VTT
-2 -1 0 ITT(A) 1 2
VCC EN VDDQ VTT IN VTT
0.90 0.906 0.90 0.904 0.90 0.902 0.90 0.900 0.89 0.898
0.896 0.89
Fig.16 ITT-VTT (DDR-)
Fig.17 Input Sequence 1
Fig.18 Input Sequence 2
VTT_IN VCC EN VDDQ VTT IN VTT
VTT
VREF ITT_IN (1A/div)
Fig.19 Input Sequence 3
Fig.20 Start up Wave Form
7/16
BLOCK DIAGRAM BD3533F/FVM/EKN
VCC VDDQ VTT_IN
VCC VCC Reference Block UVLO
VDDQ VCC SOFT TSD UVLO EN UVLO TSD
VTT_IN VCC
VTT_IN
TSD VCC EN UVLO TSD EN UVLO
VTT VTT VTTS VREF
VTT
Thermal Protection Enable EN EN
1/2x VDDQ
VREFS
DGND
PGND
BD3531F
VCC VDDQ VTT_IN
VCC VCC Reference Block 50k UVLO 50k
VDDQ VCC VCC
VTT_IN
UVLO
TSD VCC EN UVLO TSD EN UVLO
VTT
VTT
Thermal Enable Protection EN
TSD
VTTS VREF 1/2x VDDQ
GND
BD3532F/FVM/EKN
VCC VDDQ VTT_IN
VCC VCC Reference Block
VDDQ VCC SOFT UVLO UVLO TSD VCC EN UVLO TSD EN UVLO VCC
VTT_IN
50k UVLO 50k
VTT
VTT
Thermal Protection Enable EN EN
TSD
VTTS VREF 1/2x VDDQ
GND
8/16
BD3533F/BD3533FVM/BD3531F/BD3532F PIN CONFIGRATION
GND 1 EN 2 VTTS 3 VREF 4 8 VTT 7 VTT_IN 6 VCC 5 VDDQ
PIN FUNCTION
PIN No. 1 2 3 4 5 6 7 8 PIN NAME GND EN VTTS VREF VDDQ VCC VTT_IN VTT GND Pin Enable Input Pin Detector Pin for Termination Voltage Reference Voltage Output Pin Reference Voltage Input Pin VCC Pin Termination Input Pin Termination Output Pin PIN FUNCTION
BD3532KN PIN CONFIGRATION
VTT_IN2
PIN FUNCTION
PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 PIN NAME PGND1 PGND2 SGND EN N.C. VTTS N.C. N.C. N.C. VREF VREFS VDDQ N.C. N.C. N.C. VCC N.C. N.C. VTT_IN1 VTT_IN2 N.C. N.C. N.C. VTT1 VTT2 N.C. N.C. N.C. PIN FUNCTION Power Ground Pin 1 Power Ground Pin 2 Ground Pin for Reference Voltage Enable Input Pin Non Connection Detector Pin for Termination Voltage Non Connection Non Connection Non Connection Reference Voltage Output Pin Detector Pin for Reference Voltage Reference Voltage Input Pin Non Connection Non Connection Non Connection VCC Pin Non Connection Non Connection Termination Input Pin 1 Termination Input Pin 2 Non Connection Non Connection Non Connection Termination Output Pin 1 Termination Output Pin 2 Non Connection Non Connection Non Connection
NC
NC VCC VTT_IN1 NC NC
NC NC VTT1 VTT2 NC NC NC NC PGND1 SGND NC VTTS EN PGND2
NC NC VDDQ VREFS VREF NC NC
BD3533EKN PIN CONFIGRATION VTT VTT_IN VTT_IN VCC 15 VTT 16 NC 17 NC 18 NC 19 PGND 20 1 2 3 NC 4 5 14 13 12 NC 11
PIN FUNCTION
PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PIN NAME DGND EN NC VTTS VREF VREFS NC NC NC VDDQ NC VCC VTT_IN VTT_IN VTT VTT NC NC NC PGND PIN FUNCTION Digital Ground Pin Enable Input Pin Non Connection Detector Pin for Termination Voltage Reference Voltage Output Pin Detector Pin for Reference Voltage Non Connection Non Connection Non Connection Reference Voltage Input Pin Non Connection VCC Pin Termination Input Pin Termination Input Pin Termination Output Pin Termination Output Pin Non Connection Non Connection Non Connection Power Ground Pin
10 VDDQ 9 NC 8 NC 7 NC 6 VREFS
DGND EN
VTTS VREF
9/16
BD3532EFV PIN CONFIGRATION VTT1 VTT2 PGND1 PGND2 SGND EN VTTS NC VREF VREFS AGND NC NC
PIN FUNCTION
PIN No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 PIN NAME VTT1 VTT2 PGND1 PGND2 SGND EN VTTS N.C. VREF VREFS N.C. VDDQ N.C. VCC N.C. VTT_IN1 VTT_IN2 N.C. N.C. AGND FIN PIN FUNCTION Termination Output Pin 1 Termination Output Pin 2 Power Ground Pin 1 Power Ground Pin 2 Ground Pin for Reference Voltage Enable Input Pin Detector Pin for Termination Voltage Non Connection Reference Voltage Output Pin Detector Pin for Reference Voltage Non Connection Reference Voltage Input Pin Non Connection VCC Pin Non Connection Termination Input Pin 1 Termination Input Pin 2 Non Connection Non Connection Ground Pin for Analog Ground Substrate (Connected to AGND)
VTT_IN VTT_IN NC VCC NC VDDQ NC
Description of operations VCC In BD3533/31/32, an independent power input pin is provided for an internal circuit operation of the IC. This is used to drive the amplifier circuit of the IC, and its maximum current rating is 4 mA. The power supply voltage is 3.3 to 5.5 volts (BD3533) or 5 volts (BD3531/32). It is recommended to connect a bypass capacitor of 1 F or so to VCC. VDDQ Reference input pin for the output voltage, that may be used to satisfy the JEDEC requirement for DDR-SDRAM (VTT = 1/2VDDQ) by dividing the voltage inside the IC with two 50 k voltage-divider resistors For BD3533, care must be taken to an input noise to VDDQ pin because this IC also cuts such noise input into half and provides it with the voltage output divided in half. Such noise may be reduced with an RC filter consisting of such resistance and capacitance (220 and 2.2 F, for instance) that may not give significant effect to voltage dividing inside the IC. VTT_IN VTT_IN is a power supply input pin for VTT output. Voltage in the range between 1.0 and 5.5 volts may be supplied to this VTT_IN terminal, but care must be taken to the current limitation due to on-resistance of the IC and the change in allowable loss due to input/output voltage difference. Generally, the following voltages are supplied: DDR I VTT_IN=2.5V DDRII VTT_IN=1.8V Higher impedance of the voltage input at VTT_IN may result in oscillation or degradation in ripple rejection, which must be noted. To VTT_IN terminal, it is recommended to use a 10 F capacitor characterized with less change in capacitance. But it may depend on the characteristics of the power supply input and the impedance of the pc board wiring, which must be carefully checked before use. VREF In BD3533/31/32, a reference voltage output pin independent from VTT output is given to provide a reference input for a memory controller and a DRAM. Even if EN pin turns to "Low" level, VREF output is kept unchanged, compatible with "Self Refresh" state of DRAM. The maximum current capability of VREF is 20 mA, and a suitable capacitor is needed to stabilize the output voltage. It is recommended to use a combination of a 1.0 to 2.2 F ceramic capacitor characterized with less change in capacitance and a 0.5 to 2.2 phase compensator resistor, or a 10F ceramic or tantalum capacitor instead. For an application where VREF current is low, a capacitor of lower capacitance may be used. If VREF current is 1 mA or less, it is possible to secure a phase margin with a ceramic capacitor of 1 F more or less. VTTS An independent pin provided to improve load regulation of VTT output. In case that longer wiring is needed to the load at VTT output, connecting VTTS from the load side may improve the load regulation.
10/16
VTT A DDR memory termination output pin. BD3533/31/32 has a sink/source current capability of 1.0A/1.5A/3.0A respectively. The output voltage tracks the voltage divided in half at VDDQ pin. VTT output is turned to OFF when VCC UVLO or thermal shutdown protector is activated with EN pin level turned to "Low". Do not fail to connect a capacitor to VTT output pin for a loop gain phase compensation and a reduction in output voltage variation in the event of sudden change in load. Insufficient capacitance may cause an oscillation. High ESR (Equivalent Series Resistance) of the capacitor may result in increase in output voltage variation in the event of sudden change in load. It is recommended to use a 220 F functional polymer capacitor (OS-CON, POS-CAP, NEO-CAP), though it depends on ambient temperature and other conditions. A low ESR ceramic capacitor may reduce a loop gain phase margin and may cause an oscillation, which may be improved by connecting a resistor in series with the capacitor. EN With an input of 2.3 volts or higher, the level at EN pin turns to "High" to provide VTT output. If the input is lowered to 0.8 volts or less, the level at EN pin turns to "Low" and VTT status turns to Hi-Z. But if VCC and VDDQ are established, VREF output is maintained. Evaluation Board BD3533F Evaluation Board Circuit VCC EN SW1 VTT_IN VDDQ C5,C6 VCC C3,C4 J2 R4 2 EN 7 VTT_IN 5 VDDQ C9 6 VCC VTT 8 VTTS 3 VREF 4 C2 R1 C1 C7 C8 C10 VTTS J1 VREF U1 BD3533F VTT GND GND
1 GND
BD3533F Evaluation Board Application Components
Part No Value Company Parts Name Part No Value Company Parts Name
U1 R1 R4 J1 J2 C1 C2 C3
220 0 0 10uF 1uF
ROHM ROHM KYOCERA KYOCERA
BD3533F MCR032200 CM21B106M06A CM105B105K06A
C4 C5 C6 C7 C8 C9 C10
10uF 2.2uF 220uF
KYOCERA KYOCERA SANYO
CM21B106M06A CM105B225K06A 2R5TPE220MF
BD3533FSOP8 Evaluation Board Layout Silk Screen TOP Layer Bottom Layer
Versions for MSOP8 and HQFN20V packages are also available. In addition, BD3533F/FVM/EKN(1A), BD3531F(1.5A), and BD3532F/EFV/KN(3A) are available. 11/16
Heat loss Thermal design must be conducted with the operation under the conditions listed below (which are the guaranteed temperature range requiring consideration on appropriate margins etc.): 1. Ambient temperature Ta: 100C or lower 2. Chip junction temperature Tj: 150C or lower The chip junction temperature Tj can be considered as follows. See Page 14/16 for ja. Most of heat loss in BD3533/31/32 occurs at the output N-channel FET. The power lost is determined by multiplying the voltage between VIN and Vo by the output current. As this IC employs the power PKG, the thermal derating characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used. Power dissipation (W) = {Input voltage (VTT_IN) - Output voltage (VTT=1/2VDDQ)}xIo (Ave) If VTT_IN = 1.8 volts, VDDQ=1.8 volts, and Io (Ave)=0.5 A, for instance, the power dissipation is determined as follows: Power dissipation (W) = {1.8 (V) - 0.9 (V)} x 0.5 (A) = 0.4 (W) NOTE FOR USE 1.Absolute maximum ratings For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. 2.GND potential Bring the GND terminal potential to the minimum potential in any operating condition. 3.Thermal design Consider allowable loss (Pd) under actual working condition and carry out thermal design with sufficient margin provided. 4.Terminal-to-terminal short-circuit and erroneous mounting When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that enters in a clearance between outputs or output and power-GND, the IC may be destroyed. 5.Operation in strong electromagnetic field The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken. 6.Built-in thermal shutdown protection circuit The present IC incorporates a thermal shutdown protection circuit (TSD circuit). The working temperature is 175C (standard value) and has a -15C (standard value) hysteresis width. When the IC chip temperature rises and the TSD circuit operates, the output terminal is brought to the OFF state. The built-in thermal shutdown protection circuit (TSD circuit) is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. 7.Capacitor across output and GND In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1000 F between output and GND. 8.Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. 9. Inputs to IC terminals + This device is a monolithic IC with P isolation between P-substrate and each element as illustrated below. This P-layer and the N-layer of each element form a PN junction which works as: a diode if the electric potentials at the terminals satisfy the following relationship; GND>Terminal A>Terminal B, or a parasitic transistor if the electric potentials at the terminals satisfy the following relationship; Terminal B>GND Terminal A. The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in activation of parasitic elements.
Resistor PIN A PIN B C NPN Transistor Structure (NPN) B E Parasitic diode GND N P+ N N P substrate N Parasitic diode GND Parasitic diode N P substrate GND Nearby other device Parasitic diode P P+ P+ N N C B E GND P P+ PIN A
GND PIN B
12/16
10. GND wiring pattern When both a small-signal GND and high current GND are present, single-point grounding (at the set standard point) is recommended, in order to separate the small-signal and high current patterns, and to be sure the voltage change stemming from the wiring resistance and high current does not cause any voltage change in the small-signal GND. In the same way, care must be taken to avoid wiring pattern fluctuations in any connected external component GND. 11. Output capacitor (C1) Do not fail to connect a output capacitor to VREF output terminal for stabilization of output voltage. The capacitor connected to VREF output terminal works as a loop gain phase compensator. Insufficient capacitance may cause an oscillation. It is recommended to use a low temperature coefficient 1-10 F ceramic capacitor, though it depends on ambient temperature and load conditions. It is therefore requested to carefully check under the actual temperature and load conditions to be applied. 12. Output capacitor (C4) Do not fail to connect a capacitor to VTT output pin for stabilization of output voltage. This output capacitor works as a loop gain phase compensator and an output voltage variation reducer in the event of sudden change in load. Insufficient capacitance may cause an oscillation. And if the equivalent series resistance (ESR) of this capacitor is high, the variation in output voltage increases in the event of sudden change in load. It is recommended to use a 47-220 F functional polymer capacitor, though it depends on ambient temperature and load conditions. Using a low ESR ceramic capacitor may reduce a loop gain phase margin and cause an oscillation, which may be improved by connecting a resistor in series with the capacitor. It is therefore requested to carefully check under the actual temperature and load conditions to be applied. 13. Input capacitors (C2 and C3) These input capacitors are used to reduce the output impedance of power supply to be connected to the input terminals (VCC and VTT_IN). Increase in the power supply output impedance may result in oscillation or degradation in ripple rejecting characteristics. It is recommended to use a low temperature coefficient 1F (for VCC) and 10F (for VTT_IN) capacitor, but it depends on the characteristics of the power supply input, and the capacitance and impedance of the pc board wiring pattern. It is therefore requested to carefully check under the actual temperature and load conditions to be applied. 14. Input terminals (VCC, VDDQ, VTT_IN and EN) VCC, VDDQ, VTT_IN and EN terminals of this IC are made up independent one another. To VCC terminal, the UVLO function is provided for malfunction protection. Irrespective of the input order of the inputs terminals, VTT output is activated to provide the output voltage when UVLO and EN voltages reach the threshold voltage while VREF output is activated when UVLO voltage reaches the threshold. If VDDQ and VTT_IN terminals have equal potential and common impedance, any change in current at VTT_IN terminal may result in variation of VTT_IN voltage, which affects VDDQ terminal and may cause variation in the output voltage. It is therefore required to perform wiring in such manner that VDDQ and VTT_IN terminals may not have common impedance. If impossible, take appropriate corrective measures including suitable CR filter to be inserted between VDDQ and VTT_IN terminals. 15. VTTS terminal A terminal used to improve load regulation of VTT output. Connection with VTT terminal must be done not to have common impedance with high current line, which may offer better load regulation of VTT output. 16. Operating range Within the operating range, the operation and function of the circuits are generally guaranteed at an ambient temperature within the range specified. The values specified for electrical characteristics may not be guaranteed, but drastic change may not occur to such characteristics within the operating range. 17. Allowable loss Pd For the allowable loss, the thermal derating characteristics are shown in the Exhibit, which should be used as a guide. Any uses that exceed the allowable loss may result in degradation in the functions inherent to IC including a decrease in current capability due to chip temperature increase. Use within the allowable loss. 18. Built-in thermal shutdown protection circuit Thermal shutdown protection circuit is built-in to prevent thermal breakdown. Turns VTT output to OFF when the thermal shutdown protection circuit activates. This thermal shutdown protection circuit is originally intended to protect the IC itself. It is therefore requested to conduct a thermal design not to exceed the temperature under which the thermal shutdown protection circuit can work. 19. The use in the strong electromagnetic field may sometimes cause malfunction, to which care must be taken. In the event that load containing a large inductance component is connected to the output terminal, and generation of back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. 20. In the event that load containing a large inductance component is (Example) connected to the output terminal, and generation of back-EMF at the OUTPUT PIN start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. 21. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm the characteristics before using the IC. In addition, when the IC is used with the external circuit changed, decide the IC with sufficient margin provided while consideration is being given not only to static characteristics but also variations of external parts and our IC including transient characteristics.
13/16
POWER DISSIPATION SOP8(BD3533F/31F/32F)
[mW] 700 600 Power Dissipation [Pd] 500 (2) 560mW 400 300 200 100 0 0 25 50 75 100 125 150 [] 100 (1) 690mW
MSOP8(BD3533FVM)
[mW] 500 437.5mW 400 Power Dissipation [Pd]
HQFN20V(BD3533EKN)
[W] 2.5 (1) 2.0W (2) 1.75W 1.5
2.0 Power Dissipation [Pd]
300 100
200
1.0 (3) 0.75W 0.5 0 (4) 0.5W
100 0 0 25 50 75 100 125 150 []
0
25
50
75
100
125
150 []
Ambient Temperature [Ta] (1) 70mmx70mmx1.6mm Glass-epoxy PCB j-c=181/W (2) With no heat sink j-a=222/W
Ambient Temperature [Ta] With no heat sink j-a=286/W
Ambient Temperature [Ta]
(1) With no heat sink j-a=250/W (2) PCB (substrate surface copper foil area : None) j-a=166.7/W (3) PCB Single-layer substrate (substrate surface copper foil area : 15mmx15mm) j-a=71.4/W (4) PCB Double-layer substrate (substrate surface copper foil area : 60mmx60mm) j-a=62.5/W
HTSSOP-B20(BD3532EFV)
5 4 Power Dissipation [Pd] 3.20W 3 2.30W 2 1.45W 1 1.00W PCBja=125.0/W PCBja=86.2/W PCBja=54.3/W PCBja=39.1/W
VQFN28(BD3532KN)
[mW] 800 700 600 Power Dissipation [Pd] 500 400 300 200 100 0 100 (2) 460mW (1) 725mW
0
25
50
75
100
125
150
0
25
50
75
100
125
150 []
Ambient Temperature Ta() measureTH-156Kuwano Denki measure conditionRohm Standard Board PCB size70mmx70mmx1.6mmt (Thermal vias in the board) Connect the board with the exposed area at the bottom surface of the package by soldering. PCBSingle-layer substrate PCBDouble-layer substratesubstrate surface copper foil area : 15mmx15mm PCBDouble-layer substratesubstrate surface copper foil area : 70mmx70mm
Ambient Temperature [Ta]
(2) 70mmx70mmx1.6mm Glass-epoxy PCB j-c=172/W (2) With no heat sink j-a=270/W
14/16
Ordering part number
B
BD3533 BD3531 BD3532
D
3
5
3
3
F
V
M
-
T
R
Part Number
Package Type
F : SOP8 FVM : MSOP8 HFV : HTSSOP-B20 KN : VQFN28 EKN : HQFN20V
TR Emboss tape reel opposite draw-out side: 1 pin E2 Emboss tape reel opposite draw-out side: 1 pin
SOP8

Tape Quantity
5.00.2
8 5
Embossed carrier tape 2500pcs E2
(The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand)
6.20.3 4.40.2
1
4
0.150.1 0.1
1.50.1 0.11
1.27 0.40.1
0.3Min.
Direction of feed
1234
(Unit:mm)
Reel
1234
When you order , please order in times the amount of package quantity.
1234
1Pin
1234
1234
Direction of feed
1234
1234
1234
MSOP8

Tape Quantity
2.9 0.1
Embossed carrier tape 3000pcs TR
(The direction is the 1pin of product is at the upper light when you hold reel on the left hand and you pull out the tape on the right hand)
4.0 0.2
8
5
2.8 0.1
1
4
0.475
0.9Max. 0.75 0.05 0.08 0.05
0.22 0.65
+0.05 -0.04
0.29 0.15 0.6 0.2
Direction of feed
0.145 +0.05 -0.03 0.08 M
0.08 S
XX X X XXX
XX X X XXX
XX X X XXX
XX X X XXX
XX X X XXX
1Pin Reel
Direction of feed
(Unit:mm)
When you order , please order in times the amount of package quantity.
HTSSOP-B20

6.5 0.1
20 11

Tape Quantity
0.5 0.15 1.0 0.2
Embossed carrier tape 2500pcs E2
(The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand)
6.4 0.2 4.4 0.1
Direction of feed
0.325
1
10
1.0Max. 0.85 0.05 0.08 0.05
0.17 +0.05 -0.03 S 0.08 S
0.65
0.2 +0.05 -0.04
1234
Unit:mm)
Reel
1234
When you order , please order in times the amount of package quantity.
1234
1pin
1234
1234
Direction of feed
1234
1234
1234
15/16
VQFN28

5.20.1 5.00.1
21 22 15 14

Tape Embossed carrier tape(with dry pack) 2500pcs E2
(The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand)
(1.1)
Quantity
5.00.1 5.20.1
Direction of feed
.3 (0 3-
1
0.220.05
0.22 0.05
7
+0.03 0.02 -0.02 0.95MAX
0.5
0.05
(0 .
28
8
22
)
. (0 5)
5)
1234
1234
1234
1234
1234
1234
+0.1 (0.6 -0.3)
0.05
(Unit:mm)
Reel
1pin
Direction of feed
When you order , please order in times the amount of package quantity.
HQFN20V

4.20.1 4.00.1 (1.1)
15 11

(2.1) 0.5
2)
Tape Quantity
(2.1)
Embossed carrier tape(with dry pack) 2500pcs E2
(The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand)
4.20.1
4.00.1
20 1 5
6
(0
16
10
Direction of feed
.2 3- (0 .3 5)
0.220.05
0.05
+0.03 0.02 -0.02 0.95MAX
+0.1 0.6 -0.3
(0 .5
0.220.05
)
1234
1234
1234
1234
1234
1234
0.05
(Unit:mm)
Reel
1pin
Direction of feed
When you order , please order in times the amount of package quantity.
16/16
Catalog No.08T461A '08.10 ROHM (c)
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM CO.,LTD. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office.
ROHM Customer Support System
www.rohm.com
Copyright (c) 2008 ROHM CO.,LTD.
THE AMERICAS / EUROPE / ASIA / JAPAN
Contact us : webmaster@ rohm.co. jp
21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan
TEL : +81-75-311-2121 FAX : +81-75-315-0172
Appendix1-Rev3.0

▲Up To Search▲

Price & Availability of BD3532EFV

	To Download BD3532EFV Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .